Because of the radius of neighboring crystal layers, the uncut thickness should be a range rather than a certain value, as displayed in Table 2. Figure 6 Displacement vector sum of each layer in y direction. Table 2 The uncut thickness in different combinations of depth of cut and lattice plane PFT�� price Cutting direction Cutting depth (nm) Uncut thickness (nm) on (010) surface 1 0.45-0.58 2 0.87-1.01 3 1.23-1.38 on (111) surface 1 0.35-0.58 2 0.68-0.93   3 1.07-1.28 Figure 7 shows the average uncut thickness in different undeformed chip thicknesses when machined surfaces are (010) and (111) plane,

respectively. The uncut thickness increases with an increase in undeformed chip thickness. With the same combination of cutting direction and crystal orientation, the uncut thickness is nearly proportional to the undeformed chip thickness Talazoparib clinical trial on our simulation scale [17]. The uncut thickness of machining on (010) crystal orientation is about 0.1 nm bigger than that on (111) crystal orientation with the same undeformed

chip thickness, which means that the difference can be ignored considering the interplanar distance. Figure 7 The uncut thickness. In different depths of cut when machined surfaces are (010) and (111) plane, respectively. Cutting force and energy The cutting force derives from the interaction between the tool and material atoms in the molecular dynamics simulation of nanometric cutting. Since it has a great influence on the surface finish, tool wear, etc., the cutting force is monitored during the machining process. The sum of force vector GDC-0449 purchase on three axes directions, namely Fx, Fy, and Fz, are defined as tangential force, normal force, and lateral force, respectively. When machining along on (010) surface with cutting depth of 1 nm, 2 nm and 3 nm, the calculated cutting forces including tangential, normal, and lateral forces, are indicated in Figure 8. On the initial stage of the cutting process, the tangential and normal forces

start to increase rapidly until the distance of cutting increases to about 10 nm. From then on, Y-27632 2HCl the increasing rate of the cutting force starts to slow down until reaching the steady stage of the cutting process, on which the cutting forces always undulate around the equilibrium value. The lateral force fluctuates around zero because the two side forces of the tool counteract with each other. The fluctuation in cutting force derives from the thermal motion of atoms and the undulation of energy, which results from the deformation of crystal structure during nanometric cutting. Figure 8 Cutting forces. Undeformed chip thickness is (a) 1, (b) 2, and (c) 3 nm. The average tangential and normal forces during the steady stage are calculated when cutting directions are on (010) surface and on (111) surface, respectively.